Microsoft has announced that they’re now stuffing a brand new, improved system-on-chip (SoC) processor into all outgoing Xbox 250 GB Slim models.<\/p>\n
According to a report over on IBTimes, the new chip has been introduced to stay in line with AMD’s latest Bulldozer and Bobcat processor technology, as well as to promote better power efficiency and heat management in the console.<\/p>\n
The report says that the new 45nm chip will integrate a tri-core CPU, an ATI GPU, a dual-channel memory controller, I\/O, and a new front side bus (FSB) onto a single silicon, and as a bonus fun fact the thing contains 372 million transistors.<\/p>\n
The size of the console’s motherboard and power supply unit have also apparently been “drastically reduced”.<\/p>\n
Microsoft has also assured gamers that the new chip should have no compatibility issues with existing or future software, as it will “implement a latency and bandwidth that will impersonate the old system which worked with separate CPU and GPU processors”. Like DOSBox.<\/p>\n