Forget DDR3 and DDR4 - Welcome to the future

OuBoet

New member
Goodmorning gents and ladies,

I found this on the web and would like to share with you. The new Hybrid Memory Cube. And it is being led by the industry heavyweights like Samsung and Micron. We might even see it this year still (in specifications) -

The HMC Specification 1.0 currently enables companies to build memory that incorporates HMC's stacked, power efficient technology with capacities of 2 GB, 4 GB and 8 GB. While this may not seem all that impressive, a memory cube with eight links can provide an astonishing peak aggregate bandwidth of 320 GB/s, more than 20 times what is offered by current generation DDR3 memory.

HMCC is confident that Hybird Memory Cube Architecture will "leap beyond current and near-term memory architectures in the areas of performance, packaging and power efficiency." The consortium now aims to increase data rate speeds from 10, 12.5 and 15 Gb/s to 28 Gb/s for SR and from 10 Gb/s to 15 Gb/s for USR. The next revision of the HMC Specification is expected to gain consortium agreement by Q1 2014 (from http://www.tomshardware.com/news/Hybrid-Memory-Cube-Disruptive-HMCC,21814.html)

If you want to read a bit more:

http://www.pcgamer.com/2013/04/10/h...-revolution-your-memory-will-be-made-of-this/

http://www.hybridmemorycube.org/technology.html
 
Interesting. It looks like this is in a conceptual stage (unless I'm mistaken). The article from Toms Hardware mentions a release in Q1 2014. I would be interested to see which motherboards would support it. Hopefully something like this does not get stifled by slow industry adoption...
 
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